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Contact Us GLOBAL Search this site 日本語 中文 Corporate Overview Products and Services Research and Development Sustainability News Corporate Overview Message from the Management Philosophy Quick Guide to JX Metals Business Segments Corporate Data Organization and Executive Officers Corporate History Operating Sites and Group Companies Long-Term Vision and Medium-Term Management Plan Purchasing Information Products and Services Search by Category Copper Alloys and Special Steel Products Copper Foil Sputtering Targets Compound Semiconductors and Crystal Materials Metal and Compound Powders Special Ceramic Powders High Purity Metals Surface Treatment Agents Upinorg (high-purity copper sulfate) Electroless UBM Plating Service MoSi2 Heater Shielding Materials Nonferrous Metals and Chemical Products Products Under Development Search by Keyword Semiconductors and Sensors Circuit Boards Assembly Displays Batteries and Energy Additive Manufacturing Connectors Magnetic Devices Electromagnetic Shielding Communications Optics Camera Modules Piezoelectricity Thermal Control Research and Development Our Core Technologies Contributing to Societal Growth and Innovation Initiatives for Co-creation Collaboration in the Group SQUARE LAB Sustainability Sustainability Report Toward Net-Zero CO2 Emissions Activities in Environmental Conservation CSR Purchasing News News Release Trade Fairs and Exhibitions MENU HOME Products and Services Copper Alloys and Special Steel Products Copper Alloy Strip Titanium Copper Alloy ― The best alternative to beryllium copper Copper Alloy Strip Titanium Copper Alloy ― The best alternative to beryllium copper Compare Features and Typical Applications Titanium Copper Alloy Titanium copper is a copper alloy having titanium as the main additive element. Advantages include high strength along with excellent stress relaxation resistance and bend formability. Its properties are superior to those of beryllium copper alloy, long a representative standard for high-functionality copper alloys. Among the main uses are for connectors and camera modules in electronic devices such as smartphones and personal computers, taking advantage of the high strength and workability. Thanks to its outstanding stress relaxation resistance, use in automotive connectors has grown in recent years. As applications grow and the properties customers demand become more advanced as a result, we will continue our technology development toward improving properties and expanding our alloy lineup, so that such needs can be met in timely fashion. 動画を再生する Alloy name Composition Features Applications C1990 Cu-3Ti High strength, superior stress relaxation resistance Connectors, switches, jacks C1990HP Hyper Series Cu-3Ti Strength and bend formability superior to conventional titanium copper Connectors, switches, jacks C1990HP Foil (Titanium Copper Foil) Hyper Series Cu-3Ti A Hyper Titanium Copper foil product that has the highest level of strength of any copper alloy Connectors, camera modules C1990HC Cu-3Ti Electrical conductivity superior to conventional titanium copper Connectors, switches, battery terminals, jacks NKT322 Cu-3.2Ti-0.2Fe Strength (Yield strength) of 1 GPa or higher, along with excellent bend formability Connectors, switches, jacks Compare Composition and Properties Titanium Copper Alloy Composition and Properties Chemical Composition (wt%) Copper Alloy Name TiCu C1990 C1990HP C1990HC NKT322 Chemical Composition (wt%) Cu : Bal. Ti : 3.0 Cu : Bal. Ti : 3.0 Cu : Bal. Ti : 3.0 Cu : Bal. Ti : 3.0 Fe : 0.2 Physical Properties Copper Alloy Name TiCu C1990 C1990HP C1990HC NKT322 Specific Gravity (g/cm3) 8.70 8.70 8.70 8.70 Modulus of Elasticity (GPa) 127 127 XSH:115 127 120 Electrical Conductivity (%IACS@20&#8451;) 12 12 20 12 Poisson's Ratio 0.33 0.33 0.33 0.33 Mechanical Properties Copper Alloy Name TiCu C1990 C1990HP C1990HC NKT322 Tensile Strength (MPa) 1/4H 735-930 - - - H - - - 900-1000 EH 885-1080 885-1080 (950) 920-1020 SH - 910-1110 - 970-1100 ESH - 1000-1180 - 1010-1200 ESH (HB) - - - 1010-1200 XSH - 1050-1400 - - XSH (HB) - - - 1050-1250 GSH - 1300-1600 (thickness&#8806;0.1mm) - - 0.2% Yield Strength (MPa) 1/4H - - - - H - - - 800-900 EH 800-900 820-920 (900) 850-950 SH - 850-950 - 900-1000 ESH - 940-1040 - 950-1050 ESH (HB) -   - 950-1050 XSH - (1120) - - XSH (HB) - - - 1000-1100 GSH - (1390) - - Elongation (%) 1/4H 10min - - - H - - - 12min EH 5min 10min (2.0) 10min SH - 8min - 6min ESH - (3.0) - 3min ESH (HB) - - - - XSH - - - - XSH (HB) - - - - GSH - - - - Vickers Hardness (Hv) 1/4H 250min - - - H - - - (300) EH 280min (300) (300) (310) SH - (320) - (320) ESH - (340) - (340) ESH (HB) - - - (340) XSH - (340) - - XSH (HB) - - - (350) GSH - (400) - - Standard specs. (Typical values) Bend Formability Copper Alloy Name TiCu C1990 C1990HP C1990HC NKT322 Minimum Bend Radius / t Badway H - - - 0.0 0.5 - - - - t &#8806; 0.15 0.15 < t &#8806; 0.25 EH 4.0 1.0 0.0 0.5 1.0 - - - (t &#8806; 0.1mm) t &#8806; 0.15 0.15 < t &#8806; 0.25 SH - 2.0 - 1.0 2.0 - - - - t &#8806; 0.12 0.12 < t &#8806; 0.22 ESH - &#8807;5.0 - 2.0 3.0 - - - - t &#8806; 0.10 0.10 < t &#8806; 0.20 Bad way 90°W-shape Bending Width=10mm Explanation of technical terms W-shaped Bending, Minimum Bend Radius U-shaped Bending, Minimum Bend Radius Good Way / Bad Way Contact Information From the Web Contact Form Inquiries accepted 24 hours a day Products and Services Products and Services TOP Search by Category Copper Alloys and Special Steel Products Copper Alloys and Special Steel Products TOP Copper Alloy Strip Copper Alloy Strip TOP Search for products Hyper Phosphor Bronze Hyper Phosphor Bronze TOP C5210 (HP) C5240 (HP) Titanium Copper Alloy Titanium Copper Alloy TOP C1990 C1990HP C1990HC NKT322 Corson Alloys Corson Alloys TOP C7025 NKC164 NKC164E NKC4419 NKC4820 NKC286 NKC286S NKC1816 NKC388 Phosphor Bronze Nickel Silver High Conductivity Alloys High Conductivity Alloys TOP NKE010 NKE012 Copper Alloy Foil Copper Alloy Foil TOP HS1200 Sn-Cu-PET foil for electromagnetic shielding C1990HP Foil (Titanium Copper Foil) Special Steel Products Special Steel Products TOP List of Properties Copper Foil Copper Foil TOP Treated Rolled Copper Foil Treated Rolled Copper Foil TOP HA and HA-V2 foil Surface Treatment JXEFL Series Electro-Deposited Copper Foil for Flexible Printed Circuits Copper Foil for Rigid Circuit Boards Sputtering Targets Sputtering Targets TOP What Is Sputtering? Sputtering Targets for Semiconductors AlSc Sputtering Target Sputtering Targets for Flat Panel Displays Sputtering Targets for Flat Panel Displays TOP ITO Sputtering Target IZO Sputtering Target IGZO Sputtering Target Sputtering Targets for Optical Films Sputtering Targets for Optical Films TOP NS-LR Series (Low-Refractivity Target) NS-5 Series (High-Refractivity Target) Sputtering Targets for Magnetic Devices Sputtering Targets for Photovoltaic Cells Compound Semiconductors and Crystal Materials Compound Semiconductors and Crystal Materials TOP Compound Semiconductor Substrates-InP, CdZnTe (CdTe)- Strontium Titanate (SrTiO3) Rutile Titanium Dioxide (TiO2) Metal and Compound Powders Metal and Compound Powders TOP Tantalum and Niobium Materials High Purity Chlorides Metal Powders for Additive Manufacturing Other Metal Powders Special Ceramic Powders Special Ceramic Powders TOP Negative Thermal Expansion Material ZrW2O8 High Purity Metals High Purity Metals TOP High Purity Metals Low &#945; Tin Surface Treatment Agents Upinorg (high-purity copper sulfate) Electroless UBM Plating Service MoSi2 Heater Shielding Materials Shielding Materials TOP 3D formable Sheets for Electromagnetic Shielding(Mighty Shield®) Nonferrous Metals and Chemical Products Nonferrous Metals and Chemical Products TOP Refined Copper/Copper Cakes and Billets Precious Metals Rare Metals Sulfuric acid, slag, gypsum, etc. Products Under Development Products Under Development TOP Special Ceramic Powders 3D formable Sheets for Electromagnetic Shielding(Mighty Shield®) Metal Powders for Additive Manufacturing High Purity Chlorides Lead-free Piezoelectric Powder Material AlSc Sputtering Target YAG Ceramics for Laser Applications Magnesium silicide (Mg2Si) Single Crystal for Infrared Detector Search by Keyword Semiconductors and Sensors Semiconductors and Sensors TOP Copper Alloys for Lead Frames Circuit Boards Circuit Boards TOP High Strength Copper Alloys for Sockets Assembly Displays Batteries and Energy Additive Manufacturing Connectors Connectors TOP Copper Alloys for Board to Board Connectors Copper Alloys for FPC Connectors Copper Alloys for Backplane Connectors Alloys for Floating Connectors Copper Alloys for SIM Card Connectors Copper Alloys for USB Connectors Copper Alloys for Harness Connectors Magnetic Devices Electromagnetic Shielding Communications Optics Camera Modules Piezoelectricity Thermal Control Thermal Control TOP Copper Alloys for Cooling Modules Menu Contact Us Search Sitemap Page Up Corporate Overview Message from the Management Philosophy Quick Guide to JX Metals Corporation Business Segments Corporate Data Organization and Executive Officers Corporate History Operating Sites and Group Companies Long-Term Vision and Medium-Term Management Plan Purchasing Information Products and Services Search by Category Search by Keyword Research and Development Our Core Technologies Contributing to Societal Growth and Innovation Initiatives for Co-creation Collaboration in the Group SQUARE LAB Sustainability Sustainability Report Toward Net-Zero CO2 Emissions Activities in Environmental Conservation CSR Purchasing News News Release Trade Fairs and Exhibitions Close Page Up Corporate Overview Products and Services Research and Development Sustainability News Privacy Policy Terms of Use Sitemap COOKIE 設定 Copyright © JX Metals Corporation All Rights Reserved.

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